Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2016-09-13 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2016-03-15 |
| 8480302 | Micro-electro-mechanical-system temperature sensor | David L. Harmon, Timothy D. Sullivan | 2013-07-09 |
| 7867897 | Low leakage metal-containing cap process using oxidation | Jeffrey P. Gambino, Sean Smith, Jean Wynne | 2011-01-11 |
| 7830019 | Via bottom contact and method of manufacturing same | Kaushik Chanda, Lawrence A. Clevenger, Andrew P. Cowley, Baozhen Li, Chih-Chao Yang | 2010-11-09 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2010-04-06 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2009-12-29 |
| 7598614 | Low leakage metal-containing cap process using oxidation | Jeffrey P. Gambino, Sean Smith, Jean Wynne | 2009-10-06 |
| 7585764 | VIA bottom contact and method of manufacturing same | Kaushik Chanda, Lawrence A. Clevenger, Andrew P. Cowley, Baozhen Li, Chih-Chao Yang | 2009-09-08 |
| 7511378 | Enhancement of performance of a conductive wire in a multilayered substrate | David L. Harmon, Deborah M. Massey, Alvin W. Strong, Timothy D. Sullivan, Junichi Furukawa | 2009-03-31 |
| 7500208 | Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime | Fen Chen, Jeffrey P. Gambino, Baozhen Li, Timothy D. Sullivan | 2009-03-03 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2008-07-08 |
| 7388224 | Structure for determining thermal cycle reliability | Ronald G. Filippi, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2008-06-17 |
| 7231617 | Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits | Fen Chen, Jeffrey P. Gambino, Baozhen Li, Timothy D. Sullivan | 2007-06-12 |
| 7166904 | Structure and method for local resistor element in integrated circuit technology | Terence B. Hook, Randy W. Mann, William J. Murphy, William R. Tonti, Steven H. Voldman | 2007-01-23 |
| 7098054 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2006-08-29 |
| 7096450 | Enhancement of performance of a conductive wire in a multilayered substrate | David L. Harmon, Deborah M. Massey, Alvin W. Strong, Timothy D. Sullivan, Junichi Furukawa | 2006-08-22 |