Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214548 | Apparatus and method for flattening a warped substrate | Mohammed Fazil Fayaz, Steffen K. Kaldor, Conal E. Murray, Anne L. Petrosky | 2007-05-08 |
| 6734363 | Lightweight electronic equipment conductor with coolant permeable support | Raymond R. Horton, Michael J. Palmer, William Edward Pence | 2004-05-11 |
| 6503641 | Interconnects with Ti-containing liners | Cyril Cabral, Jr., Roy A. Carruthers, James M. E. Harper, Chao-Kun Hu, Kim Y. Lee +2 more | 2003-01-07 |
| 6211042 | Growth of epitaxial semiconductor films in presence of reactive metal | Fenton R. McFeely, John J. Yurkas | 2001-04-03 |
| 6029199 | Computing system having a system supervisor and a collection of computing subunits each of which has a subunit supervisor | Mark Allen, Richard I. Kaufman, Jeffrey Joseph Kleikamp, Lawrence S. Mok, Roger A. Pollak +2 more | 2000-02-22 |
| 6017401 | Conductivity improvement in thin films of refractory metal | Fenton R. McFeely, John J. Yurkas | 2000-01-25 |
| 5915462 | High efficiency thermal interposer | Bernardo Hernandez, Raymond R. Horton, Michael J. Palmer | 1999-06-29 |
| 5847926 | Lightweight packaging | Raymond R. Horton, Michael J. Palmer, William Edward Pence | 1998-12-08 |
| 5768770 | Electronic packaging shaped beam lead fabrication | Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer | 1998-06-23 |
| 5675884 | Apparatus for multilayer conductor chip packaging | Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer | 1997-10-14 |
| 5669437 | High efficiency thermal interposer | Bernardo Hernandez, Raymond R. Horton, Michael J. Palmer | 1997-09-23 |
| 5446261 | Solder application system using helix to control solder meniscus | Bernardo Hernandez, Raymond R. Horton, Michael J. Palmer, Frederick G. Weindelmayer | 1995-08-29 |
| 5322204 | Electronic substrate multiple location conductor attachment technology | Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer, Ho-Ming Tong | 1994-06-21 |
| 5263620 | Wirebond removal apparatus using alternating fluid stream | Bernardo Hernandez, Raymond R. Horton, Michael J. Palmer, Mark B. Ritter | 1993-11-23 |
| 5233221 | Electronic substrate multiple location conductor attachment technology | Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer, Ho-Ming Tong | 1993-08-03 |
| 5229328 | Method for bonding dielectric mounted conductors to semiconductor chip contact pads | Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer, Ho-Ming Tong | 1993-07-20 |
| 5205461 | Method and apparatus for fluxless solder bonding | Harry R. Bickford, Raymond R. Horton, Michael J. Palmer, John C. Zyzo | 1993-04-27 |
| 5186632 | Electronic device elastomeric mounting and interconnection technology | Raymond R. Horton, Michael J. Palmer, Mark B. Ritter | 1993-02-16 |
| 5117275 | Electronic substrate multiple location conductor attachment technology | Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer, Ho-Ming Tong | 1992-05-26 |
| 5093890 | Optical bus for computer systems | Mark F. Bregman, Mark B. Ritter, Harold S. Stone | 1992-03-03 |
| 5093879 | Electro-optical connectors | Mark F. Bregman, William D. Brewer, Mitchell S. Cohen, Glen Walden Johnson, Modest M. Oprysko +3 more | 1992-03-03 |
| 5074969 | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Michael J. Palmer +2 more | 1991-12-24 |
| 5047834 | High strength low stress encapsulation of interconnected semiconductor devices | Caroline A. Kovac | 1991-09-10 |
| 5038195 | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Michael J. Palmer +2 more | 1991-08-06 |
| 5006925 | Three dimensional microelectric packaging | Mark F. Bregman, Raymond R. Horton, Michael J. Palmer | 1991-04-09 |