Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322588 | Stimulus responsive polymer films and formulations | Gregory Blachut, Stephen M. Sirard | 2025-06-03 |
| 12119218 | Sacrificial protection layer for environmentally sensitive surfaces of substrates | Stephen M. Sirard, Ratchana Limary, Yang Pan | 2024-10-15 |
| 11862473 | Controlled degradation of a stimuli-responsive polymer film | Stephen M. Sirard, Gregory Blachut | 2024-01-02 |
| 9673037 | Substrate freeze dry apparatus and method | Stephen M. Sirard, Alan M. Schoepp | 2017-06-06 |
| 9666427 | Method of collapse-free drying of high aspect ratio structures | Stephen M. Sirard, Olivier Postel | 2017-05-30 |
| 9627608 | Dielectric repair for emerging memory devices | Nerissa Draeger, Thorsten Lill | 2017-04-18 |
| 8898928 | Delamination drying apparatus and method | Stephen M. Sirard, Alan M. Schoepp, Ratchana Limary | 2014-12-02 |
| 8591665 | Wafer heating and temperature control by backside fluid injection | Ben Mooring, John Parks | 2013-11-26 |
| 8328942 | Wafer heating and temperature control by backside fluid injection | Ben Mooring, John Parks | 2012-12-11 |
| 7135098 | Copper interconnect seed layer treatment methods and apparatuses for treating the same | — | 2006-11-14 |
| 6927198 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Wilbur C. Krusell | 2005-08-09 |
| 6666326 | Reinforced chemical mechanical planarization belt | Jibing Lin | 2003-12-23 |
| 6610601 | Bond pad and wire bond | Hugh Li | 2003-08-26 |
| 6593282 | Cleaning solutions for semiconductor substrates after polishing of copper film | Xu Li, Yuexing Zhao, John M. de Larios | 2003-07-15 |
| 6479443 | Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Wilbur C. Krusell | 2002-11-12 |
| 6423200 | Copper interconnect seed layer treatment methods and apparatuses for treating the same | — | 2002-07-23 |
| 6358847 | Method for enabling conventional wire bonding to copper-based bond pad features | Hugh Li | 2002-03-19 |
| 6324715 | Apparatus for cleaning semiconductor substrates | Mikhail Ravkin, Wibur C. Krusell, Venus Noorai | 2001-12-04 |
| 6319330 | Method and apparatus for cleaning low K dielectric and metal wafer surfaces | Linda (Tong) Jiang | 2001-11-20 |
| 6303551 | Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film | Xu Li, Yuexing Zhao, John M. de Larios | 2001-10-16 |
| 6294027 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Xu Li, Yuexing Zhao, John M. de Larios | 2001-09-25 |
| 6277203 | Method and apparatus for cleaning low K dielectric and metal wafer surfaces | Linda (Tong) Jiang | 2001-08-21 |
| 6165956 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Wilbur C. Krusell | 2000-12-26 |
| 6162301 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Wilbur C. Krusell | 2000-12-19 |
| 6145148 | Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) | Michael Ravkin, Xiuhua Zhang, Wilbur C. Krusell | 2000-11-14 |