Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7300480 | High-rate barrier polishing composition | Jinru Bian, Kai-Wei Hu, Zhendong Liu, John Francis Quanci, Matthew VanHanehem | 2007-11-27 |
| 6610601 | Bond pad and wire bond | Diane Hymes | 2003-08-26 |
| 6358847 | Method for enabling conventional wire bonding to copper-based bond pad features | Diane Hymes | 2002-03-19 |