Issued Patents All Time
Showing 1–25 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim | 2022-11-01 |
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu | 2022-11-01 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-10-12 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-06-01 |
| 10777528 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim | 2020-09-15 |
| 10658330 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu | 2020-05-19 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2019-08-20 |
| 10217873 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Il Kwon Shim, Heap Hoe Kuan | 2019-02-26 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2018-06-12 |
| 9934998 | Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy | Il Kwon Shim, Won Kyoung Choi | 2018-04-03 |
| 9754897 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2017-09-05 |
| 9721862 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu | 2017-08-01 |
| 9704824 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim | 2017-07-11 |
| 9564413 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Il Kwon Shim, Heap Hoe Kuan | 2017-02-07 |
| 9559004 | Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy | Il Kwon Shim, Won Kyoung Choi | 2017-01-31 |
| 9553162 | Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus | Thomas Strothmann, Steve Anderson, Il Kwon Shim, Heap Hoe Kuan | 2017-01-24 |
| 8999754 | Integrated circuit package with molded cavity | Seng Guan Chow, Il Kwon Shim | 2015-04-07 |
| 8779565 | Integrated circuit mounting system with paddle interlock and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2014-07-15 |
| 8704349 | Integrated circuit package system with exposed interconnects | Seng Guan Chow, II Kwon Shim | 2014-04-22 |
| 8674516 | Integrated circuit packaging system with vertical interconnects and method of manufacture thereof | In Sang Yoon, JoHyun Bae | 2014-03-18 |
| 8643163 | Integrated circuit package-on-package stacking system and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow | 2014-02-04 |
| 8395251 | Integrated circuit package to package stacking system | Il Kwon Shim, Seng Guan Chow, Jeffrey D. Punzalan, Kambhampati Ramakrishna | 2013-03-12 |
| 8378476 | Integrated circuit packaging system with stacking option and method of manufacture thereof | Seongmin Lee, SeongHun Mun | 2013-02-19 |
| 8309397 | Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2012-11-13 |
| 8269356 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Rajendra D. Pendse, Hun Teak Lee | 2012-09-18 |