Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741651 | Redistribution layer lines | Klaus Reingruber, Christian Geissler | 2017-08-22 |
| 9711492 | Three dimensional structures within mold compound | Andreas Wolter, Klaus Reingruber, Thorsten Meyer | 2017-07-18 |
| 9653324 | Integrated circuit package configurations to reduce stiffness | Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2017-05-16 |
| 9601468 | Magnetic contacts | Michael P. Skinner, Teodora Ossiander, Georg Seidemann | 2017-03-21 |
| 9564400 | Methods of forming stacked microelectronic dice embedded in a microelectronic substrate | Reinhard Mahnkopf, Wolfgang Molzer, Bernd Memmler, Edmund Goetz, Hans-Joachim Barth +1 more | 2017-02-07 |
| 9515049 | Flexibly-wrapped integrated circuit die | Michael P. Skinner, Hans-Joachim Barth, Peter Baumgartner, Harald Gossner | 2016-12-06 |
| 9397019 | Integrated circuit package configurations to reduce stiffness | Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter | 2016-07-19 |
| 9385105 | Semiconductor devices | Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Reinhard Golly +2 more | 2016-07-05 |
| 9373588 | Stacked microelectronic dice embedded in a microelectronic substrate | Reinhard Mahnkopf, Wolfgang Molzer, Bernd Memmler, Edmund Goetz, Hans-Joachim Barth +1 more | 2016-06-21 |
| 9368461 | Contact pads for integrated circuit packages | Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe, Sandeep B. Sane | 2016-06-14 |
| 9343389 | Magnetic contacts | Michael P. Skinner, Teodora Ossiander, Georg Seidemann | 2016-05-17 |
| 9312198 | Chip package-in-package and method thereof | Thorsten Meyer, Andreas Wolter | 2016-04-12 |
| 9209143 | Die edge side connection | Georg Seidemann, Teodora Ossiander, Michael P. Skinner, Hans-Joachim Barth, Harald Gossner +3 more | 2015-12-08 |
| 9142475 | Magnetic contacts | Michael P. Skinner, Teodora Ossiander, Georg Seidemann | 2015-09-22 |
| 8907480 | Chip arrangements | Thorsten Meyer, Hans-Joachim Barth, Reinhard Mahnkopf, Andreas Augustin, Christian Mueller | 2014-12-09 |
| 8878360 | Stacked fan-out semiconductor chip | Thorsten Meyer, Gerald Ofner | 2014-11-04 |
| 8786105 | Semiconductor device with chip having low-k-layers | Thorsten Meyer, Christian Geissler, Andreas Wolter, Markus Brunnbauer, David O'Sullivan +2 more | 2014-07-22 |
| 8323051 | Device for implementing a dry electrical connection of a motor vehicle lock | — | 2012-12-04 |
| 8154049 | ESD protection apparatus and electrical circuit including same | Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek +1 more | 2012-04-10 |
| 7888703 | ESD protection apparatus and electrical circuit including same | Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek +1 more | 2011-02-15 |
| 7816791 | Bonding pad for contacting a device | Carsten Ahrens, Klaus Gnannt, Ulrich Krumbein, Gunther Mackh, Patrick Schelauske +2 more | 2010-10-19 |