Issued Patents All Time
Showing 51–75 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522433 | Laminate package of chip on carrier and in cavity | Juergen Hoegerl, Gottfried Beer | 2019-12-31 |
| 10515879 | Package with component connected at carrier level | Manfred Schindler, Klaus Elian, Volker Strutz, Michael Weber | 2019-12-24 |
| 10495612 | Photoacoustic gas sensor device and a method for analyzing gas | Alfons Dehe, Stefan Kolb | 2019-12-03 |
| 10451543 | Integrated photo-acoustic gas sensor module | Thomas Mueller, Klaus Elian, Rainer Markus Schaller, Stefan Kolb | 2019-10-22 |
| 10433736 | Implantable vessel fluid sensor | Kamil Karlovsky, Bernhard Goller, Dirk Hammerschmidt, Carsten von Koblinski | 2019-10-08 |
| 10365208 | Gas sensor | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Wilhelm Wiedmeier +1 more | 2019-07-30 |
| 10241088 | Photo-acoustic gas sensor module having light emitter and detector units | Gottfried Beer, Sebastian Beer, Alfons Dehe, Franz Jost, Stefan Kolb +2 more | 2019-03-26 |
| 10138115 | Low profile transducer module | Alfons Dehe | 2018-11-27 |
| 10125012 | MEMS device | Edward Fuergut | 2018-11-13 |
| 10118816 | Method of forming a protective coating for a packaged semiconductor device | Klaus Elian | 2018-11-06 |
| 10117621 | Implantable device and implantable system comprising the same | Jan Berger, Bernhard Wedl, Dirk Hammerschmidt, Walther Pachler, Harald Witschnig | 2018-11-06 |
| 10107875 | GMR sensor within molded magnetic material employing non-magnetic spacer | Klaus Elian, Martin Petz, Uwe Schindler, Adolf Koller | 2018-10-23 |
| 10107867 | Sensor arrangement, battery cell and energy system | Klaus Elian, Jochen Dangelmaier, Franz Michael Darrer, Thomas Mueller, Mathias Vaupel +6 more | 2018-10-23 |
| 10097918 | Chip arrangement and a method for manufacturing the same | Thomas Spoettl | 2018-10-09 |
| 10060819 | Pressure sensor module having a sensor chip and passive devices within a housing | Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt +1 more | 2018-08-28 |
| 9998812 | Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals | Klaus Elian, Thomas Mueller | 2018-06-12 |
| 9986354 | Pre-mold for a microphone assembly and method of producing the same | Thomas Mueller, Stefan Uwe Schindler, Dominik Kohl, Jochen Dangelmaier | 2018-05-29 |
| 9978720 | Insulated die | Gottfried Beer, Juergen Hoegerl | 2018-05-22 |
| 9952110 | Multi-die pressure sensor package | Sebastian Beer | 2018-04-24 |
| 9927498 | Magnetic sensor device comprising a ring-shaped magnet and a sensor chip in a common package | Klaus Elian, Alexander Spielbauer, Ingrid Bollmann | 2018-03-27 |
| 9884757 | MEMS sensor package systems and methods | Bernhard Winkler, Rainer Leuschner | 2018-02-06 |
| 9868632 | Molded cavity package with embedded conductive layer and enhanced sealing | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2018-01-16 |
| 9859332 | Semiconductor component comprising magnetic field sensor | Albert Auburger | 2018-01-02 |
| 9818665 | Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces | Klaus Elian | 2017-11-14 |
| 9790086 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel | 2017-10-17 |