Issued Patents All Time
Showing 26–50 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519847 | Methods including panel bonding acts and electronic devices including cavities | — | 2022-12-06 |
| 11422144 | Magnetic-field sensor package with integrated passive component | Manfred Schindler, Michael Weber | 2022-08-23 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich +1 more | 2022-04-12 |
| 11287344 | Pressure sensor module having a sensor chip and passive devices within a housing | Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt +1 more | 2022-03-29 |
| 11289353 | Hermetically sealed housing with a semiconductor component and method for manufacturing thereof | Rainer Markus Schaller | 2022-03-29 |
| 11275059 | Apparatus and method for in-situ calibration of a photoacoustic sensor | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Juergen Woellenstein | 2022-03-15 |
| 11267698 | Low profile transducer module | Alfons Dehe | 2022-03-08 |
| 11255824 | Photoacoustic sensor module and assembly | Rainer Markus Schaller | 2022-02-22 |
| 11192777 | MEMS sensor package systems and methods | Bernhard Winkler, Rainer Leuschner | 2021-12-07 |
| 11143626 | Photo-acoustic gas sensor with optimal reference path length | — | 2021-10-12 |
| 11105776 | Detector module for a photo-acoustic gas sensor | Rainer Markus Schaller | 2021-08-31 |
| 11092538 | Wafer arrangement for gas sensor | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Wilhelm Wiedmeier +1 more | 2021-08-17 |
| 11067542 | Photoacoustic gas sensor | Alfons Dehe, Stefan Kolb | 2021-07-20 |
| 10947109 | Semiconductor component and method for producing same | Mathias Vaupel, Bernhard Knott | 2021-03-16 |
| 10870575 | Stressed decoupled micro-electro-mechanical system sensor | Bernhard Knott, Thoralf Kautzsch, Mirko Vogt, Maik Stegemann, Andre Roeth +4 more | 2020-12-22 |
| 10802124 | Sonic sensors and packages | Klaus Elian | 2020-10-13 |
| 10782270 | Photoacoustic gas sensor package | Rainer Markus Schaller, Thomas Mueller | 2020-09-22 |
| 10781095 | Molded lead frame sensor package | Jochen Dangelmaier, Manfred Schindler, Mathias Vaupel | 2020-09-22 |
| 10753858 | Wafer arrangement | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Wilhelm Wiedmeier +1 more | 2020-08-25 |
| 10677675 | Pressure sensor module having a sensor chip and passive devices within a housing | Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt +1 more | 2020-06-09 |
| 10678046 | Packages for microelectromechanical system (MEMS) mirror and methods of manufacturing the same | Cyrus Ghahremani | 2020-06-09 |
| 10616703 | MEMS sound transducer element and method for producing a MEMS sound transducer element | Matthias Steiert | 2020-04-07 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner +1 more | 2020-02-18 |
| 10527589 | Apparatus and method for in-situ calibration of a photoacoustic sensor | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Juergen Woellenstein | 2020-01-07 |
| 10519030 | Transducer package with integrated sealing | Klaus Elian, Franz Gabler, Thomas Mueller, Mathias Vaupel | 2019-12-31 |