Issued Patents All Time
Showing 51–75 of 165 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9577639 | Source separated cell | Satyanarayana Sahu, Venugopal Boynapalli, Hyeokjin Lim, Mukul Gupta, Hananel Kang +2 more | 2017-02-21 |
| 9548251 | Semiconductor interposer having a cavity for intra-interposer die | Rezaur Rahman Khan, Sam Ziqun Zhao, Pieter Vorenkamp, Kevin Kunzhong Hu, Sampath K. V. Karikalan | 2017-01-17 |
| 9508589 | Conductive layer routing | Stanley Seungchul Song, Kern Rim, Zhongze Wang, Jeffrey Junhao Xu, Choh Fei Yeap | 2016-11-29 |
| 9431371 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp | 2016-08-30 |
| 9379058 | Grounding dummy gate in scaled layout design | Stanley Seungchul Song, Zhongze Wang, Ohsang Kwon, Kern Rim, John Jianhong Zhu +3 more | 2016-06-28 |
| 9331016 | SOC design with critical technology pitch alignment | Ohsang Kwon, Esin Terzioglu, Hadi Bunnalim | 2016-05-03 |
| 9318476 | High performance standard cell with continuous oxide definition and characterized leakage current | Ohsang Kwon, Foua Vang, Animesh Datta, Seid Hadi Rasouli | 2016-04-19 |
| 9293584 | FinFET devices | Henry Chen, Agnes Woo, Wei Xia | 2016-03-22 |
| 9293393 | Stacked packaging using reconstituted wafers | Kevin Kunzhong Hu, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Sampath K. V. Karikalan | 2016-03-22 |
| 9275976 | System-in-package with integrated socket | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp | 2016-03-01 |
| 9190405 | Digital circuit design with semi-continuous diffusion standard cell | Ohsang Kwon, Satyanarayana Sahu, Divya Gangadharan, Chih-Iung Kao, Renukprasad HIREMATH +2 more | 2015-11-17 |
| 9165834 | Integrated native device without a halo implanted channel region and method for its fabrication | Akira Ito | 2015-10-20 |
| 9153507 | Semiconductor package with improved testability | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp | 2015-10-06 |
| 9129856 | Method for efficiently fabricating memory cells with logic FETs and related structure | Wei Xia | 2015-09-08 |
| 9082751 | Half-FinFET semiconductor device and related method | Wei Xia | 2015-07-14 |
| 9059179 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp | 2015-06-16 |
| 9040960 | Heterojunction tunneling field effect transistors, and methods for fabricating the same | Haining Yang | 2015-05-26 |
| 9041171 | Programmable interposer with conductive particles | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp | 2015-05-26 |
| 9041153 | MIM capacitor having a local interconnect metal electrode and related structure | Henry Chen, Wei Xia, Bruce Chih-Chieh Shen | 2015-05-26 |
| 9029983 | Metal-insulator-metal (MIM) capacitor | Haining Yang | 2015-05-12 |
| 9013041 | Semiconductor package with ultra-thin interposer without through-semiconductor vias | Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp | 2015-04-21 |
| 8993392 | Zener diode structure and process | Wei Xia | 2015-03-31 |
| 8969957 | LDMOS one-time programmable device | Akira Ito | 2015-03-03 |
| 8963223 | Scalable integrated MIM capacitor using gate metal | Wei Xia | 2015-02-24 |
| 8937357 | One-time programmable semiconductor device | Frank Hui | 2015-01-20 |