Issued Patents All Time
Showing 26–50 of 165 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11038344 | Shunt power rail with short line effect | John Jianhong Zhu, Haining Yang, Kern Rim | 2021-06-15 |
| 10965289 | Metal oxide semiconductor device of an integrated circuit | Satyanarayana Sahu, Venugopal Boynapalli, Hyeokjin Lim, Mickael Malabry, Mukul Gupta | 2021-03-30 |
| 10785043 | Load shedding system, communication method and access apparatus thereof | Jijun Yin, Qing CHEN, Zheng Wu, Xiao Lu, Hengzhi Cui +9 more | 2020-09-22 |
| 10784345 | Standard cell architecture for gate tie-off | Venugopal Boynapalli, Hyeokjin Lim | 2020-09-22 |
| 10777640 | Standard cell architecture for gate tie-off | Venugopal Boynapalli, Hyeokjin Lim | 2020-09-15 |
| 10692808 | High performance cell design in a technology with high density metal routing | Renukprasad HIREMATH, Hyeokjin Lim, Foua Vang, Venugopal Boynapalli | 2020-06-23 |
| 10600866 | Standard cell architecture for gate tie-off | Venugopal Boynapalli, Hyeokjin Lim | 2020-03-24 |
| 10593700 | Standard cell architecture with M1 layer unidirectional routing | Mukul Gupta, Ohsang Kwon, Foua Vang, Stanley Seungchul Song, Kern Rim | 2020-03-17 |
| 10490543 | Placement methodology to remove filler | Sorin Adrian Dobre, Hyeokjin Lim, Venugopal Boynapalli | 2019-11-26 |
| 10483200 | Integrated circuits (ICs) employing additional output vertical interconnect access(es) (VIA(s)) coupled to a circuit output VIA to decrease circuit output resistance | Haining Yang, John Jianhong Zhu | 2019-11-19 |
| 10431686 | Integrated circuit (IC) employing a channel structure layout having an active semiconductor channel structure(s) and an isolated neighboring dummy semiconductor channel structure(s) for increased uniformity | Haining Yang | 2019-10-01 |
| 10236886 | Multiple via structure for high performance standard cells | Satyanarayana Sahu, Venugopal Boynapalli, Hyeokjin Lim, Mickael Malabry, Mukul Gupta | 2019-03-19 |
| 10199462 | Semiconductor integrated circuits (ICs) employing localized low dielectric constant (low-K) material in inter-layer dielectric (ILD) material for improved speed performance | Haining Yang | 2019-02-05 |
| 10175571 | Hybrid coloring methodology for multi-pattern technology | Hyeokjin Lim, Ohsang Kwon, Mickael Malabry, Jingwei Zhang, Raymond George Stephany +5 more | 2019-01-08 |
| 9984029 | Variable interconnect pitch for improved performance | Kern Rim, Stanley Seungchul Song, Raymond George Stephany, John Jianhong Zhu, Ohsang Kwon +2 more | 2018-05-29 |
| 9979381 | Semi-data gated flop with low clock power/low internal power with minimal area overhead | Seid Hadi Rasouli, Venugopal Boynapalli | 2018-05-22 |
| 9960231 | Standard cell architecture for parasitic resistance reduction | Hyeokjin Lim, Satyanarayana Sahu, Venugopal Boynapalli | 2018-05-01 |
| 9941377 | Semiconductor devices with wider field gates for reduced gate resistance | Haining Yang | 2018-04-10 |
| 9887209 | Standard cell architecture with M1 layer unidirectional routing | Mukul Gupta, Ohsang Kwon, Foua Vang, Stanley Seungchul Song, Kern Rim | 2018-02-06 |
| 9831272 | Metal oxide semiconductor cell device architecture with mixed diffusion break isolation trenches | Venugopal Boynapalli, Satyanarayana Sahu, Hyeokjin Lim, Mukul Gupta | 2017-11-28 |
| 9773866 | Semiconductor integrated circuits (ICs) employing localized low dielectric constant (low-K) material in inter-layer dielectric (ILD) material for improved speed performance | Haining Yang | 2017-09-26 |
| 9755618 | Low-area low clock-power flip-flop | Seid Hadi Rasouli, Venugopal Boynapalli | 2017-09-05 |
| 9640522 | V1 and higher layers programmable ECO standard cells | Satyanarayana Sahu, Vinod Gupta, Triveni Rachapalli | 2017-05-02 |
| 9640480 | Cross-couple in multi-height sequential cells for uni-directional M1 | Mukul Gupta, Ohsang Kwon | 2017-05-02 |
| 9634026 | Standard cell architecture for reduced leakage current and improved decoupling capacitance | Satyanarayana Sahu, Ramaprasath Vilangudipitchai, Dorav Kumar | 2017-04-25 |