SN

Son V. Nguyen

IBM: 166 patents #237 of 70,183Top 1%
EL Edwards Lifesciences: 60 patents #13 of 941Top 2%
HG HGST: 13 patents #117 of 1,677Top 7%
Applied Materials: 13 patents #1,030 of 7,310Top 15%
Globalfoundries: 6 patents #578 of 4,424Top 15%
ZY Zywie: 5 patents #1 of 4Top 25%
TE Tessera: 5 patents #92 of 271Top 35%
SO Sony: 4 patents #8,966 of 25,231Top 40%
SA Siemens Aktiengesellschaft: 4 patents #3,516 of 22,248Top 20%
Lam Research: 3 patents #812 of 2,128Top 40%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
AS Adeia Semiconductor Solutions: 1 patents #22 of 57Top 40%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Samsung: 1 patents #49,284 of 75,807Top 70%
AM AMD: 1 patents #5,683 of 9,279Top 65%
📍 Schenectady, NY: #4 of 1,353 inventorsTop 1%
🗺 New York: #76 of 115,490 inventorsTop 1%
Overall (All Time): #1,644 of 4,157,543Top 1%
271
Patents All Time

Issued Patents All Time

Showing 251–271 of 271 patents

Patent #TitleCo-InventorsDate
5855962 Flowable spin-on insulator Donna R. Cote 1999-01-05
5773362 Method of manufacturing an integrated ULSI heatsink William R. Tonti, Jack A. Mandelman, Jerzy M. Zalesinski, Toshiharu Furukawa, Dureseti Chidambarrao 1998-06-30
5770469 Method for forming semiconductor structure using modulation doped silicate glasses Kevin J. Uram, John Kevin Shugrue, Nathan Sandler, Matthias Ilg 1998-06-23
5753948 Advanced damascene planar stack capacitor fabrication method Matthias Ilg, Kevin J. Uram 1998-05-19
5729052 Integrated ULSI heatsink William R. Tonti, Jack A. Mandelman, Jerzy M. Zalesinski, Toshiharu Furukawa, Dureseti Chidambarrao 1998-03-17
5714798 Selective deposition process Michael D. Armacost, Steven A. Grundon, David L. Harmon, John F. Rembetski 1998-02-03
5622596 High density selective SiO.sub.2 :Si.sub.3 N.sub.4 etching using a stoichiometrically altered nitride etch stop Michael D. Armacost, David M. Dobuzinsky, Jeffrey P. Gambino 1997-04-22
5618379 Selective deposition process Michael D. Armacost, Steven A. Grundon, David L. Harmon, John F. Rembetski 1997-04-08
5610441 Angle defined trench conductor for a semiconductor device Daniel Carl, Donald M. Kenney, Walter E. Mlynko 1997-03-11
5563105 PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element David M. Dobuzinsky, Tetsuo Matsuda, James G. Ryan, Michael J. Shapiro 1996-10-08
5538592 Non-random sub-lithography vertical stack capacitor Bomy Chen, Gary B. Bronner 1996-07-23
5539154 Fluorinated silicon nitride films David M. Dobuzinsky, Douglas J. Dopp, David L. Harmon 1996-07-23
5536360 Method for etching boron nitride David M. Dobuzinsky 1996-07-16
5468687 Method of making TA.sub.2 O.sub.5 thin film by low temperature ozone plasma annealing (oxidation) Dan Carl, David M. Dobuzinsky, Tue Nguyen 1995-11-21
5462812 Fluorinated silicon nitride films David M. Dobuzinsky, Douglas J. Dopp, David L. Harmon 1995-10-31
5455204 Thin capacitor dielectric by rapid thermal processing David M. Dobuzinsky, Tue Nguyen 1995-10-03
5412246 Low temperature plasma oxidation process David M. Dobuzinsky, David L. Harmon, Srinandan R. Kasi, Donald M. Kenney, Tue Nguyen +1 more 1995-05-02
5217567 Selective etching process for boron nitride films Donna R. Cote, David M. Dobuzinsky 1993-06-08
5204138 Plasma enhanced CVD process for fluorinated silicon nitride films David M. Dobuzinsky, Douglas J. Dopp, David L. Harmon 1993-04-20
4811067 High density vertically structured memory Brian F. Fitzgerald, Kim Y. Nguyen 1989-03-07
4635139 Asperity burst writer James M. Severson 1987-01-06