Issued Patents All Time
Showing 176–200 of 223 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492270 | Structure for nano-scale metallization and method for fabricating same | David V. Horak, Elbert E. Huang, Sivananda K. Kanakasabapathy, Charles W. Koburger, III, Chih-Chao Yang | 2013-07-23 |
| 8492274 | Metal alloy cap integration | Chih-Chao Yang, Marc A. Bergendahl, Steven J. Holmes, David V. Horak, Charles W. Koburger, III | 2013-07-23 |
| 8482132 | Pad bonding employing a self-aligned plated liner for adhesion enhancement | Chih-Chao Yang, David V. Horak, Takeshi Nogami | 2013-07-09 |
| 8476160 | Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall | David V. Horak, Chih-Chao Yang | 2013-07-02 |
| 8440505 | Semiconductor chips including passivation layer trench structure | Deepak Kulkarni, Michael Lane, Satyanarayana V. Nitta | 2013-05-14 |
| 8432002 | Method and structure for low resistive source and drain regions in a replacement metal gate process flow | Balasubramanian S. Haran, Kangguo Cheng, Theodorus E. Standaert, Tenko Yamashita | 2013-04-30 |
| 8421239 | Crenulated wiring structure and method for integrated circuit interconnects | Griselda Bonilla, Elbert E. Huang, Satyanarayana V. Nitta | 2013-04-16 |
| 8420459 | Bulk fin-field effect transistors with well defined isolation | Kangguo Cheng, Balasubramanian S. Haran, Theodorus E. Standaert, Tenko Yamashita | 2013-04-16 |
| 8404582 | Structure and method for manufacturing interconnect structures having self-aligned dielectric caps | David V. Horak, Takeshi Nogami, Chih-Chao Yang | 2013-03-26 |
| 8399350 | Formation of air gap with protection of metal lines | Takeshi Nogami, Shyng-Tsong Chen, David V. Horak, Son V. Nguyen, Chih-Chao Yang | 2013-03-19 |
| 8390079 | Sealed air gap for semiconductor chip | David V. Horak, Elbert E. Huang, Charles W. Koburger, III, Douglas C. La Tulipe, Jr. | 2013-03-05 |
| 8383507 | Method for fabricating air gap interconnect structures | Kaushik Chanda, Cathryn J. Christiansen, Daniel C. Edelstein, Satyanarayana V. Nitta, Son V. Nguyen +1 more | 2013-02-26 |
| 8354703 | Semiconductor capacitor | David V. Horak, Hosadurga Shobha, Chih-Chao Yang | 2013-01-15 |
| 8354751 | Interconnect structure for electromigration enhancement | David V. Horak, Chih-Chao Yang | 2013-01-15 |
| 8349674 | Forming borderless contact for transistors in a replacement metal gate process | David V. Horak, Charles W. Koburger, III, Chih-Chao Yang | 2013-01-08 |
| 8299625 | Borderless interconnect line structure self-aligned to upper and lower level contact vias | David V. Horak, Charles W. Koburger, III, Chih-Chao Yang | 2012-10-30 |
| 8288268 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami +1 more | 2012-10-16 |
| 8232195 | Method for fabricating back end of the line structures with liner and seed materials | Chih-Chao Yang, Shyng-Tsong Chen, Terry A. Spooner | 2012-07-31 |
| 8232204 | Method of forming borderless contact for transistor | David V. Horak, Charles W. Koburger, III, Steven J. Holmes, Chih-Chao Yang | 2012-07-31 |
| 8232618 | Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly approach | Gregory Breyta, David V. Horak, Elbert E. Huang, Charles W. Koburger, III, Douglas C. La Tulipe, Jr. | 2012-07-31 |
| 8227339 | Creation of vias and trenches with different depths | David V. Horak, Takeshi Nogami, Chih-Chao Yang | 2012-07-24 |
| 8211776 | Integrated circuit line with electromigration barriers | David V. Horak, Takeshi Nogami, Chih-Chao Yang | 2012-07-03 |
| 8120179 | Air gap interconnect structures and methods for forming the same | Kaushik Chanda, Cathryn J. Christiansen, Daniel C. Edelstein, Satyanarayana V. Nitta, Son V. Nguyen +1 more | 2012-02-21 |
| 8030202 | Temporary etchable liner for forming air gap | David V. Horak, Elbert E. Huang, Charles W. Koburger, III | 2011-10-04 |
| 8021974 | Structure and method for back end of the line integration | Chih-Chao Yang, David V. Horak, Takeshi Nogami | 2011-09-20 |