Issued Patents All Time
Showing 76–100 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340221 | Stacked FinFET anti-fuse | Alexander Reznicek, Oscar van der Straten, Keith E. Fogel | 2019-07-02 |
| 10340355 | Method of forming a dual metal interconnect structure | Hemanth Jagannathan, Koichi Motoyama, Oscar van der Straten | 2019-07-02 |
| 10312097 | Salicide bottom contacts | Alexander Reznicek, Oscar van der Straten | 2019-06-04 |
| 10304735 | Mechanically stable cobalt contacts | Keith Kwong Hon Wong, Wonwoo Kim | 2019-05-28 |
| 10304938 | Maskless method to reduce source-drain contact resistance in CMOS devices | Hemanth Jagannathan, Christian Lavoie | 2019-05-28 |
| 10304841 | Metal FinFET anti-fuse | Alexander Reznicek, Oscar van der Straten, Miaomiao Wang, Chih-Chao Yang | 2019-05-28 |
| 10304773 | Low resistance contact structures including a copper fill for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-05-28 |
| 10269698 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Koichi Motoyama | 2019-04-23 |
| 10269710 | Multi-level metallization interconnect structure | Alexander Reznicek, Oscar van der Straten | 2019-04-23 |
| 10249501 | Single process for liner and metal fill | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-04-02 |
| 10249724 | Low resistance contact structures for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-04-02 |
| 10224281 | Metallic blocking layer for reliable interconnects and contacts | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-03-05 |
| 10211207 | Low resistance source/drain contacts for complementary metal oxide semiconductor (CMOS) devices | Oleg Gluschenkov, Dechao Guo, Zuoguang Liu, Rajasekhar Venigalla, Tenko Yamashita | 2019-02-19 |
| 10211095 | High performance middle of line interconnects | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-02-19 |
| 10170419 | Biconvex low resistance metal wire | Alexander Reznicek, Oscar van der Straten | 2019-01-01 |
| 10170360 | Reflow enhancement layer for metallization structures | Alexander Reznicek, Oscar van der Straten | 2019-01-01 |
| 10170423 | Metal cap integration by local alloying | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2019-01-01 |
| 10147680 | Method to reduce variability in contact resistance | Hemanth Jagannathan, Christian Lavoie, Jean L. Sweet | 2018-12-04 |
| 10141308 | Low resistance source/drain contacts for complementary metal oxide semiconductor (CMOS) devices | Oleg Gluschenkov, Dechao Guo, Zuoguang Liu, Rajasekhar Venigalla, Tenko Yamashita | 2018-11-27 |
| 10128188 | High aspect ratio contact metallization without seams | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-11-13 |
| 10128151 | Devices and methods of cobalt fill metallization | Vimal Kamineni, James J. Kelly, Oscar van der Straten, Balasubramanian Pranatharthiharan | 2018-11-13 |
| 10121789 | Self-aligned source/drain contacts | Emre Alptekin, Kangguo Cheng, Balasubramanian Pranatharthiharan, Shom Ponoth | 2018-11-06 |
| 10115665 | Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-10-30 |
| 10109740 | Programmable bulk FinFET antifuses | Alexander Reznicek, Oscar van der Straten | 2018-10-23 |
| 10090287 | Deep high capacity capacitor for bulk substrates | Keith E. Fogel, Alexander Reznicek, Oscar van der Straten | 2018-10-02 |