Issued Patents All Time
Showing 101–125 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090151 | Structure and method to reduce copper loss during metal cap formation | Alexander Reznicek, Oscar van der Straten | 2018-10-02 |
| 10074727 | Low resistivity wrap-around contacts | Adra Carr, Alexander Reznicek, Oscar van der Straten | 2018-09-11 |
| 10056391 | Vertically stacked FinFET fuse | Alexander Reznicek, Oscar van der Straten | 2018-08-21 |
| 10056329 | Programmable buried antifuse | Keith E. Fogel, Alexander Reznicek, Oscar van der Straten | 2018-08-21 |
| 10049980 | Low resistance seed enhancement spacers for voidless interconnect structures | Joseph F. Maniscalco, Alexander Reznicek, Oscar van der Straten | 2018-08-14 |
| 10038050 | FinFET resistor and method to fabricate same | Keith E. Fogel, Alexander Reznicek, Oscar van der Straten | 2018-07-31 |
| 10037942 | Low resistance contact structures for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-07-31 |
| 10032721 | Low resistance contact structures for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-07-24 |
| 10026693 | Method, apparatus, and system for MOL interconnects without titanium liner | Vimal Kamineni, Mark V. Raymond, Chengyu Niu | 2018-07-17 |
| 10008507 | Metal FinFET anti-fuse | Alexander Reznicek, Oscar van der Straten, Miaomiao Wang, Chih-Chao Yang | 2018-06-26 |
| 10008563 | Dielectric with air gaps for use in semiconductor devices | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-06-26 |
| 10002789 | High performance middle of line interconnects | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-06-19 |
| 9997416 | Low resistance dual liner contacts for fin field-effect transistors (FinFETs) | Veeraraghavan S. Basker, Zuoguang Liu | 2018-06-12 |
| 9997590 | FinFET resistor and method to fabricate same | Keith E. Fogel, Alexander Reznicek, Oscar van der Straten | 2018-06-12 |
| 9997453 | Antifuse having comb-like top electrode | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-06-12 |
| 9978750 | Low resistance source/drain contacts for complementary metal oxide semiconductor (CMOS) devices | Oleg Gluschenkov, Dechao Guo, Zuoguang Liu, Rajasekhar Venigalla, Tenko Yamashita | 2018-05-22 |
| 9960240 | Low resistance contact structures for trench structures | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-05-01 |
| 9954050 | Precise/designable FinFET resistor structure | Shanti Pancharatnam, Alexander Reznicek, Oscar van der Straten | 2018-04-24 |
| 9947621 | Structure and method to reduce copper loss during metal cap formation | Alexander Reznicek, Oscar van der Straten | 2018-04-17 |
| 9941204 | III-V compatible anti-fuses | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-04-10 |
| 9934977 | Salicide bottom contacts | Alexander Reznicek, Oscar van der Straten | 2018-04-03 |
| 9935051 | Multi-level metallization interconnect structure | Alexander Reznicek, Oscar van der Straten | 2018-04-03 |
| 9922941 | Thin low defect relaxed silicon germanium layers on bulk silicon substrates | Keith E. Fogel, Alexander Reznicek, Oscar van der Straten | 2018-03-20 |
| 9881798 | Metal cap integration by local alloying | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-01-30 |
| 9876075 | Method of forming dielectric with air gaps for use in semiconductor devices | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2018-01-23 |