Issued Patents All Time
Showing 76–87 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2005-07-19 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Xianmin Tang, Praburam Gopalraja, John C. Forster, Jick Yu | 2005-05-03 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2004-07-06 |
| 6743714 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Fusen Chen, Ted Guo, Liang-Yuh Chen | 2004-06-01 |
| 6726776 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Fusen Chen, Ted Guo | 2004-04-27 |
| 6613199 | Apparatus and method for physical vapor deposition using an open top hollow cathode magnetron | Jeffrey Tobin, Jean Lu, Thomas W. Mountsier | 2003-09-02 |
| 6500762 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Imran Hashim, John C. Forster | 2002-12-31 |
| 6436819 | Nitrogen treatment of a metal nitride/metal stack | Zhi ZHANG, David Pung, Nitin Khurana, Roderick C. Mosely | 2002-08-20 |
| 6391776 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Imran Hashim, John C. Forster | 2002-05-21 |
| 6355560 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Fusen Chen, Ted Guo | 2002-03-12 |
| 6110821 | Method for forming titanium silicide in situ | Gene Y. Kohara, Fusen Chen, Hyman J. Levinstein, Zheng Xu, Peijun Ding +1 more | 2000-08-29 |
| 5877087 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Fusen Chen, Ted Guo | 1999-03-02 |