| 7144769 |
Method to achieve increased trench depth, independent of CD as defined by lithography |
Kevin K. Chan, Subhash B. Kulkarni, Rajiv Ranade |
2006-12-05 |
| 6842235 |
Optical measurement of planarized features |
Syed Zaidi |
2005-01-11 |
| 6821864 |
Method to achieve increased trench depth, independent of CD as defined by lithography |
Kevin K. Chan, Subhash B. Kulkarni, Rajiv Ranade |
2004-11-23 |
| 6821900 |
Method for dry etching deep trenches in a substrate |
Satish D. Athavale, Rajiv Ranade, Munir D. Naeem |
2004-11-23 |
| 6809005 |
Method to fill deep trench structures with void-free polysilicon or silicon |
Rajiv Ranade, Kevin K. Chan, Subhash B. Kulkarni |
2004-10-26 |
| 6743727 |
Method of etching high aspect ratio openings |
Siddhartha Panda, Rajiv Ranade |
2004-06-01 |
| 6709917 |
Method to increase the etch rate and depth in high aspect ratio structure |
Siddhartha Panda, Rajiv Ranade |
2004-03-23 |
| 6687014 |
Method for monitoring the rate of etching of a semiconductor |
Shoaib Zaidi |
2004-02-03 |
| 6544838 |
Method of deep trench formation with improved profile control and surface area |
Rajiv Ranade, Munir D. Naeem |
2003-04-08 |
| 6489249 |
Elimination/reduction of black silicon in DT etch |
Rajiv Ranade |
2002-12-03 |
| 6284666 |
Method of reducing RIE lag for deep trench silicon etching |
Munir D. Naeem, Byeong Y. Kim, Stephan Kudelka, Brian Lee, Heon Lee +3 more |
2001-09-04 |
| 6224690 |
Flip-Chip interconnections using lead-free solders |
Panayotis Andricacos, Madhav Datta, Hariklia Deligianni, Wilma Jean Horkans, Sung Kwon Kang +4 more |
2001-05-01 |
| 5759437 |
Etching of Ti-W for C4 rework |
Madhav Datta, Thomas S. Kanarsky, Ravindra V. Shenoy |
1998-06-02 |
| 5391510 |
Formation of self-aligned metal gate FETs using a benignant removable gate material during high temperature steps |
Louis L. Hsu, Rajiv V. Joshi |
1995-02-21 |
| 5258264 |
Process of forming a dual overhang collimated lift-off stencil with subsequent metal deposition |
David Stanasolovich, Giorgio G. Via |
1993-11-02 |
| 5024896 |
Collimated metal deposition |
David Stanasolovich, Giorgio G. Via |
1991-06-18 |
| 4741799 |
Anisotropic silicon etching in fluorinated plasma |
Lee Chen |
1988-05-03 |
| 4671849 |
Method for control of etch profile |
Lee Chen |
1987-06-09 |
| 4617730 |
Method of fabricating a chip interposer |
Pieter Geldermans |
1986-10-21 |
| 4602981 |
Monitoring technique for plasma etching |
Lee Chen |
1986-07-29 |
| 4534816 |
Single wafer plasma etch reactor |
Lee Chen, Charles J. Hendricks, Stanley J. Poloncic |
1985-08-13 |
| 4511430 |
Control of etch rate ratio of SiO.sub.2 /photoresist for quartz planarization etch back process |
Lee Chen |
1985-04-16 |
| 4490210 |
Laser induced dry chemical etching of metals |
Lee Chen, Tung J. Chuang |
1984-12-25 |
| 4490211 |
Laser induced chemical etching of metals with excimer lasers |
Lee Chen, John R. Lankard, Sr. |
1984-12-25 |
| 4478677 |
Laser induced dry etching of vias in glass with non-contact masking |
Lee Chen, Tung J. Chuang |
1984-10-23 |
