Issued Patents All Time
Showing 251–270 of 270 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546188 | Bow-balanced 3D chip stacking | Albert M. Young, Roy R. Yu | 2013-10-01 |
| 8492869 | 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman +2 more | 2013-07-23 |
| 8470628 | Methods to fabricate silicide micromechanical device | Michael A. Guillorn, Eric A. Joseph, Zhen Zhang | 2013-06-25 |
| 8440523 | Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch | Michael A. Guillorn, Ying Zhang | 2013-05-14 |
| 8409957 | Graphene devices and silicon field effect transistors in 3D hybrid integrated circuits | Josephine B. Chang, Wilfried E. Haensch, Zihong Liu | 2013-04-02 |
| 8408262 | Adaptive chuck for planar bonding between substrates | Dechao Guo, Leathen Shi, Keith Kwong Hon Wong | 2013-04-02 |
| 8399336 | Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman +2 more | 2013-03-19 |
| 8298914 | 3D integrated circuit device fabrication using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman +2 more | 2012-10-30 |
| 8239786 | Local multivariable solver for optical proximity correction in lithographic processing method, and device manufactured thereby | William S. Wong, Been-Der Chen, Yen-Wen Lu | 2012-08-07 |
| 8232704 | Electric motor | Rui Feng Qin | 2012-07-31 |
| 8198174 | Air channel interconnects for 3-D integration | Louis Hsu, Brian L. Ji, Conal E. Murray | 2012-06-12 |
| 8131336 | Automated in vivo plaque composition evaluation | William Kerwin, Dongxiang Xu, Chun Yuan | 2012-03-06 |
| 8076177 | Scalable transfer-join bonding lock-and-key structures | Kuan-Neng Chen | 2011-12-13 |
| 8053317 | Method and structure for improving uniformity of passive devices in metal gate technology | Satya N. Chakravarti, Dechao Guo, Wilfried E. Haensch, Pranita Kulkarni, Philip J. Oldiges +1 more | 2011-11-08 |
| 8047877 | Quickly assembled universal serial bus (USB) connector | Ou Yang, Hong-Tu Zhang, Ping Chen, Ming-Chiang Chen | 2011-11-01 |
| 7985615 | Method of forming a carbon nanotube/nanowire thermo-photovoltaic cell | Ma Siguang, Kang L. Wang | 2011-07-26 |
| 7959238 | Anti-lock braking system | Rui Feng Qin, Ting Xu | 2011-06-14 |
| 7887376 | Audio jack connector | Hong-Tu Zhang, Ping Chen, Ming-Chiang Chen | 2011-02-15 |
| D620444 | Receptacle connector | Ou Yang, Hong-Tu Zhang, Ping Chen, Ming-Chiang Chen | 2010-07-27 |
| 7427754 | Telegraph signal microscopy device and method | Kang L. Wang | 2008-09-23 |