CP

Christopher J. Penny

IBM: 150 patents #285 of 70,183Top 1%
TE Tessera: 11 patents #38 of 271Top 15%
AS Adeia Semiconductor Solutions: 2 patents #9 of 57Top 20%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Saratoga Springs, NY: #3 of 363 inventorsTop 1%
🗺 New York: #212 of 115,490 inventorsTop 1%
Overall (All Time): #5,065 of 4,157,543Top 1%
165
Patents All Time

Issued Patents All Time

Showing 126–150 of 165 patents

Patent #TitleCo-InventorsDate
9991156 Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more 2018-06-05
9978560 System and method for performing nano beam diffraction analysis Marc A. Bergendahl, James J. Demarest, Roger QUON, Christopher J. Waskiewicz 2018-05-22
9972533 Aligning conductive vias with trenches Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more 2018-05-15
9966337 Fully aligned via with integrated air gaps Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Michael Rizzolo, Hosadurga Shobha 2018-05-08
9966305 Ion flow barrier structure for interconnect metallization James J. Demarest, James J. Kelly, Koichi Motoyama, Oscar van der Straten 2018-05-08
9960117 Air gap semiconductor structure with selective cap bilayer Stephen M. Gates, Elbert E. Huang, Dimitri Kioussis, Deepika Priyadarshini 2018-05-01
9934970 Self aligned pattern formation post spacer etchback in tight pitch configurations Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +2 more 2018-04-03
9929088 Airgap protection layer for via alignment Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo 2018-03-27
9911651 Skip-vias bypassing a metallization level at minimum pitch Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2018-03-06
9911647 Self aligned conductive lines Sean D. Burns, Lawrence A. Clevenger, Anuja E. DeSilva, Nelson Felix, Sivananda K. Kanakasabapathy +3 more 2018-03-06
9905513 Selective blocking boundary placement for circuit locations requiring electromigration short-length Benjamin D. Briggs, Elbert E. Huang, Joe Lee 2018-02-27
9899256 Self-aligned airgaps with conductive lines and vias Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2018-02-20
9899338 Structure and fabrication method for enhanced mechanical strength crack stop Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2018-02-20
9852946 Self aligned conductive lines Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more 2017-12-26
9837355 Method for maximizing air gap in back end of the line interconnect through via landing modification Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo 2017-12-05
9837485 High-density MIM capacitors Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2017-12-05
9837305 Forming deep airgaps without flop over Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2017-12-05
9824982 Structure and fabrication method for enhanced mechanical strength crack stop Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2017-11-21
9793193 Air gap and air spacer pinch off Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini 2017-10-17
9793206 Heterogeneous metallization using solid diffusion removal of metal interconnects Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo 2017-10-17
9793213 Ion flow barrier structure for interconnect metallization James J. Demarest, James J. Kelly, Koichi Motoyama, Oscar van der Straten 2017-10-17
9786554 Self aligned conductive lines Sean D. Burns, Lawrence A. Clevenger, Anuja E. DeSilva, Nelson Felix, Sivananda K. Kanakasabapathy +3 more 2017-10-10
9786760 Air gap and air spacer pinch off Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini 2017-10-10
9780027 Hybrid airgap structure with oxide liner Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz 2017-10-03
9779944 Method and structure for cut material selection Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +3 more 2017-10-03