Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8747608 | Plasma processing apparatus | Kazuhiro Joo, Takashi Fujii | 2014-06-10 |
| 8425786 | Plasma etching method and plasma etching apparatus | Makoto Satake, Kenji Maeda, Kenetsu Yokogawa, Tsutomu Tetsuka, Ryoji Nishio | 2013-04-23 |
| 8197634 | Plasma processing apparatus | Kenetsu Yokogawa | 2012-06-12 |
| 8088247 | Plasma processing apparatus | Kazuhiro Joo, Takashi Fujii | 2012-01-03 |
| 8083888 | Plasma processing apparatus | Tsuyoshi Yoshida, Tsuyoshi Matsumoto, Satoru Muto, Kenetsu Yokogawa | 2011-12-27 |
| 8071397 | Semiconductor fabricating apparatus with function of determining etching processing state | Motohiko Yoshigai, Kazuhiro Jyouo, Tetsuo Ono | 2011-12-06 |
| 7686917 | Plasma processing system and apparatus and a sample processing method | Toshio Masuda, Mitsuru Suehiro, Hiroshi Kanekiyo, Hideyuki Yamamoto, Kazue Takahashi +1 more | 2010-03-30 |
| 7455790 | Emission spectroscopic processing apparatus and plasma processing method using it | Tetsunori Kaji, Shizuaki Kimura, Takashi Fujii | 2008-11-25 |
| 7411684 | Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji | 2008-08-12 |
| 7259866 | Semiconductor fabricating apparatus with function of determining etching processing state | Motohiko Yoshigai, Kazuhiro Jyouo, Tetsuo Ono | 2007-08-21 |
| 7230720 | Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji | 2007-06-12 |
| 7169254 | Plasma processing system and apparatus and a sample processing method | Toshio Masuda, Mitsuru Suehiro, Hiroshi Kanekiyo, Hideyuki Yamamoto, Kazue Takahashi +1 more | 2007-01-30 |
| 7126697 | Method and apparatus for determining endpoint of semiconductor element fabricating process | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji, Hideyuki Yamamoto | 2006-10-24 |
| 7009715 | Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processed | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji, Hideyuki Yamamoto | 2006-03-07 |
| 6972848 | Semiconductor fabricating apparatus with function of determining etching processing state | Motohiko Yoshigai, Kazuhiro Jyouo, Tetsuo Ono | 2005-12-06 |
| 6967109 | Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units | Tetsuo Ono, Ryoji Nishio, Kazue Takahashi, Nobuyuki Mise | 2005-11-22 |
| 6961131 | Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji | 2005-11-01 |
| 6923885 | Plasma processing system and apparatus and a sample processing method | Toshio Masuda, Mitsuru Suehiro, Hiroshi Kanekiyo, Hideyuki Yamamoto, Kazue Takahashi +1 more | 2005-08-02 |
| 6903826 | Method and apparatus for determining endpoint of semiconductor element fabricating process | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji, Hideyuki Yamamoto | 2005-06-07 |
| 6890771 | Plasma processing method using spectroscopic processing unit | Tetsunori Kaji, Shizuaki Kimura, Takashi Fujii | 2005-05-10 |
| 6835665 | Etching method of hardly-etched material and semiconductor fabricating method and apparatus using the method | Nobuyuki Mise, Ken Yoshioka, Ryoji Nishio | 2004-12-28 |
| 6830649 | Apparatus and method for producing semiconductors | Akira Kagoshima, Hideyuki Yamamoto, Yoshimi Torii | 2004-12-14 |
| 6815228 | Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method | Takashi Fujii, Motohiko Yoshigai, Tetsunori Kaji | 2004-11-09 |
| 6797529 | Processing apparatus with measuring unit and method | Toru Otsubo | 2004-09-28 |
| 6759253 | Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units | Tetsuo Ono, Ryoji Nishio, Kazue Takahashi, Nobuyuki Mise | 2004-07-06 |