Issued Patents All Time
Showing 101–124 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040421 | Methods for fabricating integrated circuits with improved contact structures | Xuan Lin, Vimal Kamineni | 2015-05-26 |
| 9018711 | Selective growth of a work-function metal in a replacement metal gate of a semiconductor device | Xiuyu Cai, Hoon Kim | 2015-04-28 |
| 8980740 | Barrier layer conformality in copper interconnects | Errol Todd Ryan | 2015-03-17 |
| 8962478 | Method to use self-repair Cu barrier to solve barrier degradation due to Ru CMP | Kunaljeet Tanwar | 2015-02-24 |
| 8932934 | Methods of self-forming barrier integration with pore stuffed ULK material | Moosung Chae, Errol Todd Ryan, Nicholas V. LiCausi, Christian Witt, Ailian Zhao +3 more | 2015-01-13 |
| 8907483 | Semiconductor device having a self-forming barrier layer at via bottom | Larry Zhao, Ming He, Sean Xuan Lin | 2014-12-09 |
| 8889549 | Methods of forming conductive structures using a sacrificial liner layer | Nicholas V. LiCausi, Errol Todd Ryan | 2014-11-18 |
| 8883631 | Methods of forming conductive structures using a sacrificial material during a metal hard mask removal process | Kunaljeet Tanwar, Xiuyu Cai | 2014-11-11 |
| 8883020 | Achieving greater planarity between upper surfaces of a layer and a conductive structure residing therein | Xiuyu Cai | 2014-11-11 |
| 8877633 | Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier system | Hoon Kim, Vivian W. Ryan | 2014-11-04 |
| 8859419 | Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device | Larry Zhao, Ming He, Sean Xuan Lin, John A. Iacoponi, Errol Todd Ryan | 2014-10-14 |
| 8791014 | Methods of forming copper-based conductive structures on semiconductor devices | Hoon Kim, Chanro Park | 2014-07-29 |
| 8772158 | Multi-layer barrier layer stacks for interconnect structures | Vivian W. Ryan, Paul R. Besser | 2014-07-08 |
| 8753975 | Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting device | Larry Zhao, Ming He, Sean Xuan Lin, John A. Iacoponi, Errol Todd Ryan | 2014-06-17 |
| 8728931 | Multi-layer barrier layer for interconnect structure | Vivian W. Ryan, Paul R. Besser | 2014-05-20 |
| 8722534 | Method for reducing wettability of interconnect material at corner interface and device incorporating same | Hoon Kim, Vivian W. Ryan | 2014-05-13 |
| 8704372 | Integrated circuits and methods for processing integrated circuits with embedded features | Errol Todd Ryan | 2014-04-22 |
| 8691696 | Methods for forming an integrated circuit with straightened recess profile | Xiuyu Cai, Ruilong Xie, Errol Todd Ryan, John A. Iacoponi | 2014-04-08 |
| 8673766 | Methods of forming copper-based conductive structures by forming a copper-based seed layer having an as-deposited thickness profile and thereafter performing an etching process and electroless copper deposition | Sean Xuan Lin, Ming He, Larry Zhao | 2014-03-18 |
| 8623758 | Subtractive metal multi-layer barrier layer for interconnect structure | Vivian W. Ryan, Paul R. Besser | 2014-01-07 |
| 8609531 | Methods of selectively forming ruthenium liner layer | — | 2013-12-17 |
| 8586473 | Methods for fabricating integrated circuits with ruthenium-lined copper | Kunaljeet Tanwar, Ming He | 2013-11-19 |
| 8517769 | Methods of forming copper-based conductive structures on an integrated circuit device | Sean Xuan Lin, Ming He, Larry Zhao | 2013-08-27 |
| 8431482 | Integrated circuits and methods for processing integrated circuits with embedded features | Errol Todd Ryan | 2013-04-30 |