Issued Patents All Time
Showing 26–50 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10586782 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Brian W. Quinlan, Thomas A. Wassick | 2020-03-10 |
| 10515929 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds | 2019-12-24 |
| 10431563 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds | 2019-10-01 |
| 10424527 | Electronic package with tapered pedestal | Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga | 2019-09-24 |
| 10327343 | Applying pressure to adhesive using CTE mismatch between components | Michael J. Fisher, David C. Long, Donald A. Merte, Robert Weiss | 2019-06-18 |
| 10264665 | Tamper-respondent assemblies with bond protection | William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more | 2019-04-16 |
| 10257924 | Tamper-proof electronic packages formed with stressed glass | James A. Busby, Silvio Dragone, Michael J. Fisher, Michael A. Gaynes, David C. Long +2 more | 2019-04-09 |
| 10251288 | Tamper-respondent assembly with vent structure | Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, James Edward Tersigni | 2019-04-02 |
| 10242931 | Liquid cooled compliant heat sink and related method | Raschid J. Bezama, David C. Long, Govindarajan Natarajan | 2019-03-26 |
| 10178818 | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) | Michael J. Fisher, David C. Long, Michael T. Peets | 2019-01-08 |
| 10177075 | Liquid cooled compliant heat sink and related method | Raschid J. Bezama, David C. Long, Govindarajan Natarajan | 2019-01-08 |
| 10172232 | Tamper-respondent assemblies with enclosure-to-board protection | William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher +3 more | 2019-01-01 |
| 9999124 | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking | James A. Busby, Michael J. Fisher, Michael A. Gaynes, David C. Long | 2018-06-12 |
| 9913416 | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) | Michael J. Fisher, David C. Long, Michael T. Peets | 2018-03-06 |
| 9913389 | Tamper-respondent assembly with vent structure | Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, James Edward Tersigni | 2018-03-06 |
| 9913370 | Tamper-proof electronic packages formed with stressed glass | James A. Busby, Silvio Dragone, Michael J. Fisher, Michael A. Gaynes, David C. Long +2 more | 2018-03-06 |
| 9913362 | Tamper-respondent assemblies with bond protection | William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more | 2018-03-06 |
| 9894749 | Tamper-respondent assemblies with bond protection | William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long +1 more | 2018-02-13 |
| 9877383 | Tamper-respondent assemblies with enclosure-to-board protection | William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher +3 more | 2018-01-23 |
| 9875986 | Micro-scrub process for fluxless micro-bump bonding | Katsuyuki Sakuma | 2018-01-23 |
| 9735041 | Universal clamping fixture to maintain laminate flatness during chip join | Donald A. Merte | 2017-08-15 |
| 9717154 | Enclosure with inner tamper-respondent sensor(s) | William L. Brodsky, John R. Dangler, Zachary Thomas Dreiss, David C. Long, Michael T. Peets +1 more | 2017-07-25 |
| 9716028 | Universal clamping fixture to maintain laminate flatness during chip join | Donald A. Merte | 2017-07-25 |
| 9673177 | Selectively soluble standoffs for chip joining | Benjamin V. Fasano, Mark W. Kapfhammer, David J. Lewison, Thomas E. Lombardi | 2017-06-06 |
| 9661747 | Tamper-respondent assemblies with enclosure-to-board protection | William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher +3 more | 2017-05-23 |