Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600755 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Kwangmo Chris Lim | 2020-03-24 |
| 10446455 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2019-10-15 |
| 10297515 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2019-05-21 |
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2018-10-02 |
| 10062626 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2018-08-28 |
| 9984947 | Fingerprint sensor and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2018-05-29 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2018-03-20 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2018-03-06 |
| 9744070 | Snoring prevention device | Yeong-Chul Choi, Hye-Young Joung | 2017-08-29 |
| 9728476 | Fingerprint sensor and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2017-08-08 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Byong Jin Kim, Gi Jeong Kim, Won Bae Bang | 2017-01-24 |
| 9543235 | Semiconductor package and method therefor | Hyung Il Jeon, Byong Jin Kim, In Bae Park, Jae Min Bae, No Sun Park | 2017-01-10 |
| 9513254 | Microfluidic sensor package structure and method | Hyung-II Jeon, Chan Ha Hwang, Byong Jin Kim, Yung Woo Lee, Do Hyun Na +1 more | 2016-12-06 |
| 9418942 | Semiconductor device | Yoon Joo Kim, Do Hyun Na | 2016-08-16 |
| 9412729 | Semiconductor package and fabricating method thereof | Choon Heung Lee, Glenn Rinne, Byong Jin Kim | 2016-08-09 |
| 9293398 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2016-03-22 |
| 9184148 | Semiconductor package and method therefor | Hyung Il Jeon, Byong Jin Kim, In Bae Park, Jae Min Bae, No Sun Park | 2015-11-10 |
| 8729710 | Semiconductor package with patterning layer and method of making same | Do Hyeong Kim, Bong Chan Kim, Yoon Joo Kim | 2014-05-20 |
| 7956453 | Semiconductor package with patterning layer and method of making same | Do Hyeong Kim, Bong Chan Kim, Yoon Joo Kim | 2011-06-07 |
| 7906855 | Stacked semiconductor package and method of making same | Yoon Joo Kim, In Tae Kim, Bong Chan Kim, Do Hyung Kim, Sung Chul Ha +2 more | 2011-03-15 |
| 7859107 | Solder attach film and assembly | Min Yoo, Tae-Seong Kim | 2010-12-28 |
| 7847398 | Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing | Seok Ho Na, Jae Yun Kim, Yoon Joo Kim | 2010-12-07 |
| 7723852 | Stacked semiconductor package and method of making same | Yoon Joo Kim, In Tae Kim, Bong Chan Kim, Do Hyung Kim, Sung Chul Ha +2 more | 2010-05-25 |