Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804447 | Semiconductor device having conductive wire with increased attachment angle and method | Jun-Ho Jeon, Kyeong Sool Seong, Jeong Il Kim, Young Kyu Kim, Sung-Ho Jeon +6 more | 2023-10-31 |
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song +1 more | 2023-09-05 |
| 10943871 | Semiconductor device having conductive wire with increased attachment angle and method | Jun-Ho Jeon, Kyeong Sool Seong, Jeong Il Kim, Young Kyu Kim, Sung-Ho Jeon +6 more | 2021-03-09 |
| 10141269 | Semiconductor device having conductive wire with increased attachment angle and method | Jun-Ho Jeon, Kyeong Sool Seong, Jeong Il Kim, Young Kyu Kim, Sung-Ho Jeon +6 more | 2018-11-27 |
| 7847398 | Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing | Jae Yun Kim, Yoon Joo Kim, Ji Young Chung | 2010-12-07 |
| 5894008 | Method for manufacturing an alumina-silicon carbide nanocomposite | — | 1999-04-13 |