Issued Patents All Time
Showing 51–54 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7718523 | Solder attach film and method of forming solder ball using the same | Min Yoo, Tae-Seong Kim | 2010-05-18 |
| 7170183 | Wafer level stacked package | Bong Chan Kim, Yoon Joo Kim | 2007-01-30 |
| 7145251 | Colored conductive wires for a semiconductor package | Sang-hyun Ryu, Chan Yeok Park | 2006-12-05 |
| 6888242 | Color contacts for a semiconductor package | Sang-hyun Ryu, Chan Yeok Park | 2005-05-03 |