Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475718 | Semiconductor device package comprising a dielectric layer with built-in inductor | Chien-Hua Chen, Hung-Yi Lin, Cheng-Yuan KUNG, Shiuan-Yu LIN | 2019-11-12 |
| 9929132 | Semiconductor device and process of making the same | Chien-Hua Chen, Yung-Shun Chang, Pao-Nan Lee | 2018-03-27 |
| 9881917 | Semiconductor device and method of manufacturing the same | Hsu-Chiang Shih, Sheng-Chi Hsieh, Chien-Hua Chen | 2018-01-30 |
| 9837352 | Semiconductor device and method for manufacturing the same | Yung-Shun Chang, Chien-Hua Chen | 2017-12-05 |
| 9577027 | Semiconductor device and process of making the same | Chien-Hua Chen, Yung-Shun Chang, Pao-Nan Lee | 2017-02-21 |
| 8853819 | Semiconductor structure with passive element network and manufacturing method thereof | Chien-Hua Chen, Hsu-Chiang Shih, Meng-Wei Hsieh | 2014-10-07 |
| 8778769 | Semiconductor package having passive device and method for making the same | Chien-Hua Chen | 2014-07-15 |
| 8415790 | Semiconductor package having passive device and method for making the same | Chien-Hua Chen | 2013-04-09 |
| 8368173 | Semiconductor package and method for making the same | Chien-Hua Chen | 2013-02-05 |
| 8274133 | Semiconductor package and method for making the same | Chien-Hua Chen | 2012-09-25 |
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu +3 more | 2011-11-15 |
| 7614888 | Flip chip package process | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu +3 more | 2009-11-10 |
| 7581666 | Wire-bonding method for wire-bonding apparatus | Ho-Ming Tong, Chao-Fu Weng, Chian-Chi Lin, Chih-Nan Wei, Song-Fu Yang +2 more | 2009-09-01 |
| 7547575 | Two-stage die-bonding method for simultaneous die-bonding of multiple dies | Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Chian-Chi Lin, Chia-Jung Tsai +2 more | 2009-06-16 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Chao-Fu Weng, Chian-Chi Lin, Che-Ya Chou, Shin-Hua Chao +2 more | 2008-11-04 |