Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6723630 | Solder ball fabrication process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-04-20 |
| 6724075 | Semiconductor chip package and manufacturing method thereof | Shih-Chang Lee, Cheng-Yin Lee | 2004-04-20 |
| 6720244 | Bump fabrication method | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-04-13 |
| 6716739 | Bump manufacturing method | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2004-04-06 |
| 6714421 | Flip chip package substrate | Kun-Ching Chen, Ho-Ming Tong | 2004-03-30 |
| 6713320 | Bumping process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-03-30 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen, Shyh-Ing Wu +5 more | 2004-02-17 |
| 6673711 | Solder ball fabricating process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-01-06 |
| 6664128 | Bump fabrication process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +4 more | 2003-12-16 |
| 6617237 | Lead-free bump fabrication process | Ho-Ming Tong, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2003-09-09 |
| 6561411 | Wire bonding process and wire bond structure | — | 2003-05-13 |
| 6469399 | Semiconductor package | Jen-Kuang Fang | 2002-10-22 |
| 6429049 | Laser method for forming vias | Jaw-Shiun Hsieh, Yao-Hsin Feng, Shyh-Ing Wu, Kuan-Neng Liao, Chin-Pei Tien | 2002-08-06 |
| 6420244 | Method of making wafer level chip scale package | — | 2002-07-16 |
| 6312976 | Method for manufacturing leadless semiconductor chip package | Chun-Hung Lin, Su Tao | 2001-11-06 |
| 6291271 | Method of making semiconductor chip package | Kao-Yu Hsu | 2001-09-18 |
| 6271057 | Method of making semiconductor chip package | Kao-Yu Hsu | 2001-08-07 |
| 6201299 | Substrate structure of BGA semiconductor package | Su Tao, Chih-Ming Chung, Jian-Cheng Chen | 2001-03-13 |
| 6191360 | Thermally enhanced BGA package | Su Tao, Han-Hsiang Huang, Kun-Ching Chen | 2001-02-20 |
| 6163076 | Stacked structure of semiconductor package | Kuang-Lin Lo, Kuang-Chwn Chou, Shih-Chih Chen | 2000-12-19 |