Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160219 | Metal ribs in electromechanical devices | Hau Nguyen, Masamitsu Matsuura | 2024-12-03 |
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +2 more | 2024-11-26 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora | 2024-10-22 |
| 12074134 | Package for stress sensitive component and semiconductor device | Mahmud Halim Chowdhury, Hau Nguyen, Masamitsu Matsuura, Ting-Ta Yen | 2024-08-27 |
| 12057264 | Forming integrated inductors and transformers with embedded magnetic cores | — | 2024-08-06 |
| 12021019 | Semiconductor device package with thermal pad | Ashok S. Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |
| 12009336 | Packages with electrical fuses | Mahmud Halim Chowdhury, Amin Ahmad Sijelmassi, Murali Kittappa, Honglin Guo, Joe Adam Garcia +1 more | 2024-06-11 |
| 11955456 | Flip chip packaged devices with thermal pad | Ashok S. Prabhu, Hau Nguyen, Kurt Sincerbox, Makoto Shibuya | 2024-04-09 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga | 2024-03-26 |
| 11923281 | Semiconductor package with isolated heat spreader | Woochan Kim, Vivek Kishorechand Arora | 2024-03-05 |