Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160219 | Metal ribs in electromechanical devices | Anindya Poddar, Hau Nguyen | 2024-12-03 |
| 12074134 | Package for stress sensitive component and semiconductor device | Anindya Poddar, Mahmud Halim Chowdhury, Hau Nguyen, Ting-Ta Yen | 2024-08-27 |
| 12057417 | Wafer chip scale package | Daiki Komatsu | 2024-08-06 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Kengo Aoya, Hideaki Matsunaga, Anindya Poddar | 2024-03-26 |
| 11923320 | Semiconductor device having tapered metal coated sidewalls | Tomoko Noguchi, Mutsumi Masumoto, Kengo Aoya | 2024-03-05 |