Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160219 | Metal ribs in electromechanical devices | Anindya Poddar, Masamitsu Matsuura | 2024-12-03 |
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12074134 | Package for stress sensitive component and semiconductor device | Anindya Poddar, Mahmud Halim Chowdhury, Masamitsu Matsuura, Ting-Ta Yen | 2024-08-27 |
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Ashok S. Prabhu, Edgar Dorotyao Balidoy, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Ashok S. Prabhu, Kurt Sincerbox, Makoto Shibuya | 2024-04-09 |