Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Makoto Shibuya | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Makoto Shibuya | 2024-04-09 |