Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Hau Nguyen, Kurt Sincerbox, Makoto Shibuya | 2024-04-09 |