Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |