Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125627 | Multilayer inductor component | Daiki Kato, Masashi SHIMOYASU, Yoji Tozawa, Seiichi Nakagawa, Akihiko OIDE +1 more | 2024-10-22 |
| 12094642 | Multilayer inductor component | Masashi SHIMOYASU, Daiki Kato, Yoji Tozawa, Takashi Endo, Seiichi Nakagawa +4 more | 2024-09-17 |
| 12080142 | Information presentation method, information presentation system, and information presentation apparatus | Masaya Yamamoto, Tomoki Ogawa, Kunio Gobara, Atsushi Tanaka, Masashi HITOTSUYA | 2024-09-03 |
| 12046542 | Heat-dissipating wirebonded members on package surfaces | Makoto Shibuya, Kengo Aoya | 2024-07-23 |
| 12040122 | Multilayer coil component | Youichi KAZUTA, Hajime Kato, Kazuya TOBITA, Yuto SHIGA, Noriaki HAMACHI | 2024-07-16 |
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Ashok S. Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Ming-Yang Li | 2024-06-25 |
| 11894195 | Electronic component | Yoji Tozawa, Masashi SHIMOYASU, Takuo Abe, Akihiko OIDE, Tsutomu Ono +3 more | 2024-02-06 |