Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Vivek Kishorechand Arora, Anindya Poddar | 2024-10-22 |
| 12046542 | Heat-dissipating wirebonded members on package surfaces | Makoto Shibuya, Makoto Yoshino | 2024-07-23 |
| 12040260 | Electronic package with surface contact wire extensions | Makoto Shibuya, Ayumu Kuroda | 2024-07-16 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Masamitsu Matsuura, Hideaki Matsunaga, Anindya Poddar | 2024-03-26 |
| 11923320 | Semiconductor device having tapered metal coated sidewalls | Tomoko Noguchi, Mutsumi Masumoto, Masamitsu Matsuura | 2024-03-05 |