Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |