Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +2 more | 2024-11-26 |
| 12136588 | Heat slug attached to a die pad for semiconductor package | Woochan Kim | 2024-11-05 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Anindya Poddar | 2024-10-22 |
| 11929311 | Isolated semiconductor package with HV isolator on block | Woochan Kim | 2024-03-12 |
| 11923281 | Semiconductor package with isolated heat spreader | Anindya Poddar, Woochan Kim | 2024-03-05 |
| 11908834 | Multi-chip package with reinforced isolation | Woochan Kim | 2024-02-20 |
| 11869839 | Package panel processing with integrated ceramic isolation | Woochan Kim, Benjamin A. Samples | 2024-01-09 |
| 11870341 | Isolated power converter package with molded transformer | Yi Yan | 2024-01-09 |