Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12138367 | Plasma-assisted flexible multi-scale topographic patches for engineering cellular behavior and tissue regeneration | Jangho Kim | 2024-11-12 |
| 12136588 | Heat slug attached to a die pad for semiconductor package | Vivek Kishorechand Arora | 2024-11-05 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2024-10-22 |
| 12019861 | Electronic apparatus and the method for controlling thereof | Junhwa OH, Dahye Kim, Sookkyung Lee, Hyunbin Lee, Dale AHN +1 more | 2024-06-25 |
| 12009280 | IC package with heat spreader | Rongwei Zhang, Patrick Francis Thompson | 2024-06-11 |
| 11982782 | Method and device for analyzing 3D target maneuver using line array sensor | Taeil Suh | 2024-05-14 |
| 11930378 | Apparatus and method for performing calibration in wireless communication system | Jongpil Lee, Soo-Jin Kim | 2024-03-12 |
| 11929311 | Isolated semiconductor package with HV isolator on block | Vivek Kishorechand Arora | 2024-03-12 |
| 11923281 | Semiconductor package with isolated heat spreader | Anindya Poddar, Vivek Kishorechand Arora | 2024-03-05 |
| 11908834 | Multi-chip package with reinforced isolation | Vivek Kishorechand Arora | 2024-02-20 |
| 11869839 | Package panel processing with integrated ceramic isolation | Benjamin A. Samples, Vivek Kishorechand Arora | 2024-01-09 |