Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062596 | Semiconductor die with stepped side surface | Chien-Hao Wang, Bob Lee | 2024-08-13 |
| 12009280 | IC package with heat spreader | Woochan Kim, Patrick Francis Thompson | 2024-06-11 |