Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009280 | IC package with heat spreader | Rongwei Zhang, Woochan Kim | 2024-06-11 |
| 12009319 | Integrated circuit with metal stop ring outside the scribe seal | Christopher Daniel Manack, Qiao Chen, Michael Todd Wyant, Matthew John Sherbin | 2024-06-11 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone | 2024-05-14 |
| 11942386 | Electronic devices in semiconductor package cavities | Christopher Daniel Manack, Qiao Chen | 2024-03-26 |