Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180595 | Chemically anchored mold compounds in semiconductor packages | — | 2024-12-31 |
| 12154845 | Semiconductor package with nickel-silver pre-plated leadframe | Bernardo Gallegos | 2024-11-26 |
| 12139569 | Filler particles for polymers | Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo | 2024-11-12 |
| 12074096 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Salvatore Frank Pavone | 2024-08-27 |
| 12068221 | Plating for thermal management | Christopher Daniel Manack, Salvatore Frank Pavone | 2024-08-20 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Salvatore Frank Pavone, Patrick Francis Thompson | 2024-05-14 |
| 11938715 | SP2-bonded carbon structures | Luigi Colombo, Benjamin Stassen Cook, Archana Venugopal | 2024-03-26 |
| 11935821 | Quad flat no-lead package with wettable flanges | — | 2024-03-19 |
| 11908776 | Semiconductor device with metal die attach to substrate with multi-size cavity | Benjamin Stassen Cook, Sreenivasan K. Koduri | 2024-02-20 |