Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100678 | Conductive members for die attach in flip chip packages | Christopher Daniel Manack, Maricel Fabia Escaño, Rafael Jose Lizares Guevara | 2024-09-24 |
| 12074096 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Nazila Dadvand | 2024-08-27 |
| 12068221 | Plating for thermal management | Nazila Dadvand, Christopher Daniel Manack | 2024-08-20 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Patrick Francis Thompson | 2024-05-14 |
| 11948871 | Process for thin film capacitor integration | Benjamin Stassen Cook, Yogesh Kumar Ramadass, Mahmud Halim Chowdhury | 2024-04-02 |
| 11876065 | Flip chip package assembly | Katleen Fajardo Timbol, Rafael Jose Lizares Guevara | 2024-01-16 |