Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142586 | Efficient redistribution layer topology | Christopher Daniel Manack, Joseph Liu | 2024-11-12 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson | 2024-05-14 |
| 11978709 | Integrated system-in-package with radiation shielding | Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2024-05-07 |