Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165989 | Semiconductor package with electromagnetic interference shielding | Jie Chen, Yiqi Tang, Liang Wan | 2024-12-10 |
| 12148556 | Integrated magnetic assembly | Yiqi Tang, Jonathan Almeria Noquil | 2024-11-19 |
| 12113293 | Antenna-on-package including multiple types of antenna | Yiqi Tang | 2024-10-08 |
| 12040265 | High-frequency ceramic packages with modified castellation and metal layer architectures | Yiqi Tang, Li Jiang | 2024-07-16 |
| 11978709 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Liang Wan, Hiep Xuan Nguyen | 2024-05-07 |
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Sylvester Ankamah-Kusi, Yiqi Tang, Sreenivasan K. Koduri | 2024-05-07 |
| 11955479 | Packaged semiconductor device | Yiqi Tang, Makarand Ramkrishna Kulkarni | 2024-04-09 |
| 11901271 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Manu J. Prakuzhy | 2024-02-13 |
| 11881460 | Ceramic semiconductor package seal rings | Yiqi Tang, Li Jiang | 2024-01-23 |