Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901271 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, Manu J. Prakuzhy, Rajen Manicon Murugan | 2024-02-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901271 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, Manu J. Prakuzhy, Rajen Manicon Murugan | 2024-02-13 |