Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015019 | Stacked die multichip module package | Jonathan Almeria Noquil | 2024-06-18 |
| 11963042 | System and method for offloading traffic from a cellular network to a broadcast network | Arindam Chakraborty, Anindya Saha, Gururaj Padaki, Parag Naik, Preetham Uthaiah | 2024-04-16 |
| 11955479 | Packaged semiconductor device | Yiqi Tang, Rajen Manicon Murugan | 2024-04-09 |