Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176274 | Multi-die package with multiple heat channels | Osvaldo Jorge Lopez, Tianyi Luo | 2024-12-24 |
| 12148556 | Integrated magnetic assembly | Yiqi Tang, Rajen Manicon Murugan | 2024-11-19 |
| 12015019 | Stacked die multichip module package | Makarand Ramkrishna Kulkarni | 2024-06-18 |
| 11930590 | Stress relief for flip-chip packaged devices | Tianyi Luo, Osvaldo Jorge Lopez, Satyendra Singh Chauhan, Bernardo Gallegos | 2024-03-12 |
| 11908780 | Semiconductor package with solder standoff | Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez | 2024-02-20 |