Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11930590 | Stress relief for flip-chip packaged devices | Tianyi Luo, Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Bernardo Gallegos | 2024-03-12 |
| 11908780 | Semiconductor package with solder standoff | Jonathan Almeria Noquil, Lance Cole Wright, Osvaldo Jorge Lopez | 2024-02-20 |