Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176274 | Multi-die package with multiple heat channels | Jonathan Almeria Noquil, Tianyi Luo | 2024-12-24 |
| 11930590 | Stress relief for flip-chip packaged devices | Tianyi Luo, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Bernardo Gallegos | 2024-03-12 |
| 11908780 | Semiconductor package with solder standoff | Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright | 2024-02-20 |