Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154845 | Semiconductor package with nickel-silver pre-plated leadframe | Nazila Dadvand | 2024-11-26 |
| 11930590 | Stress relief for flip-chip packaged devices | Tianyi Luo, Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Satyendra Singh Chauhan | 2024-03-12 |