Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176274 | Multi-die package with multiple heat channels | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2024-12-24 |
| 11930590 | Stress relief for flip-chip packaged devices | Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Bernardo Gallegos | 2024-03-12 |